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Semiconductor devices are now extremely sophisticated so silicon wafers need high-quality and high-performance specs. SUMCO TECHXIV CORPORATION understands the high level of sophistication and product variety customers need and offers various, specialty high-spec silicon wafers. We carefully select the polycrystal material and use our proprietary crystallization control technologies to produce single-crystal silicon and silicon ingots that have superior uniform quality unchanged from the single crystallization. Various silicon wafers are designed from these single crystals to give the utmost performance and deliver high yields to the customer through our technical expertise and sophisticated advanced technologies.

Epitaxial wafers

Thin defect-free crystalline Si layer is grown on the surface of polished wafer by chemical vapor deposition. Resistivity of the epi layer can be different from that of the substrate. Excellent gate oxide integrity is guaranteed. Furthermore, effective gettering of Fe impurity in p/p+ epitaxial wafers is ensured.

Applications:

Applications: Power MOS-FETs, IGBTs, schottky diodes, CPUs, MPUs, CCDs, and flash memory chips.

List of products by wafer diameter

For epitaxial wafers, high-quality and low-cost wafers are also available.

Descriptions in the table above are for reference to the product outline by wafer diameter.
(Silicon wafer specs are subject to change without notice.)

Annealed wafers

An advanced, ultra-clean hydrogen annealing of polished wafers greatly improves crystalline perfection of the near-surface region and reduces surface micro-roughness, resulting in a superior gate oxide integrity.

Applications:

Flash memory chips, DRAMs, M/ROMs, SRAMs, and other logic devices.

List of products by wafer diameter

For annealed wafers, two kinds of hydrogen annealed and argon annealed wafers are available.

Descriptions in the table above are for reference to the product outline by wafer diameter.
(Silicon wafer specs are subject to change without notice. )

Polished wafers

Etched wafers are chemically and mechanically polished using a polishing slurry.

Applications:

MOS-ICs, bipolar ICs, CCDs, and memory chips.

List of products by wafer diameter

Descriptions in the table above are for reference to the product outline by wafer diameter.
(Silicon wafer specs are subject to change without notice. )

Diffused wafers

Consist of double layers with different resistivity. The accuracy and uniformity of the depth of the diffused layer (Xj) and non-diffused layer (Xi) are at a very high level. Dimensional accuracy of the face, sides and back are also outstanding, giving Komatsu an excellent reputation with users.

Applications:

Power transistors, MOS-FETs.

List of products by wafer diameter

Descriptions in the table above are for reference to the product outline by wafer diameter.
(Silicon wafer specs are subject to change without notice. )

Etched wafers

Lapped wafers are etched with chemicals to remove the damaged layer.

Applications:

Diodes, power transistors, and thyristors.

List of products by wafer diameter

Descriptions in the table above are for reference to the product outline by wafer diameter.
(Silicon wafer specs are subject to change without notice. )

Lapped wafers

Both sides of the sliced wafer are lapped with slurry.

Applications:

Diodes, power transistors, and thyristors.

List of products by wafer diameter

Descriptions in the table above are for reference to the product outline by wafer diameter.
(Silicon wafer specs are subject to change without notice. )

Sliced wafers

Ingots are sliced into thin discs with a circular diamond blade or wire saw.

Applications:

Diodes

List of products by wafer diameter

Descriptions in the table above are for reference to the product outline by wafer diameter.
(Silicon wafer specs are subject to change without notice. )